Front view
Back view
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MIL-STD-810, Operational Temperature, Method 501, Procedure I/II: -10°C to +50°C,
-40°C operational with SSD, capable of -40°C to +71°C with select processors
MIL-STD-810, Storage, Method 501, Procedure I/II: -30°C to +75°C
MIL-STD-810, Humidity, Method 507, Procedure II: 240 hours with humidity kit
MIL-STD-810, Altitude, Method 500: 10,000ft operation, 20,000ft transport
MIL-STD-810, Vibration, Method 514, Procedure I: 1.5 GRMS, 5-2,000Hz, 75 min/axis
MIL-STD-810, Shock, Method 516, Procedures I/V: 20g, 11msec; 3 axes, each
direction
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2 x XEON CPU E5-2608L V3 2.0GHZ 6-CORE 6.4GT/S QPI, 1866MH DDR4,15MB,LGA2011 R3,52W,INTEL
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2 x 8GB DDR4REG ECC RDIMM,2400MHZ
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2 x 256GB 2.5 IN 7MM, AES-256 SSD SATA
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1 option slot for PCI-E X16 card
Hardware Specification
Enviroment
Electromagnetic Compatibility standards
Mechanical 2U
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Height: 3.5” (8.89 cm)
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Width: 17.5” (44.45 cm) EIA-310 Rack Compliant
Depth: 13”(33.02 cm) -
Weight: 20 lbs. (9kg) [excludes vibration kit mods]
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AC, FCC Compliant
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AC, MIL-STD-461, RE102, CE102 compliant
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DC, MIL-STD-461, RE102, CE102 compliant
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RTCA DO-160 Section 21, Category M
Optional Expansion Card
4 port 10Gp SFP+ ports
HSM Crypto Card
8 to 32 port RS232/422
4 port 1Gb Ethernet